Service Offered :
BGA & MICRO BGA PLACEMENT
CABLE AND WIRE HARNESS ASSEMBLY
PCB DESIGN & REVERSE ENGINEERING
BOX BUILD ASSMEMBLY
IN CIRCUIT TESTING/FUNCTIONAL TESTING
AUTOMATED OPTICAL INSPECTION
20,000 square foot air-conditioned, static free environment.
Two surface mount machines & one through hole line.
Mechanical assembly area provides box build capability.
Separate prototype area with capability for manual & semi-au- tomated assembly.
Test areas for ﬁxture & ﬁxtureless ICT plus functional test.
Inspection & ﬁnishing area including optical inspection, X-Ray
stations, rework stations & burn-in capability.
Warehousing area for component & FG inventory.
ESD safe shipping, receiving & inspection area.
Laser alignment & vision systems for SMT placement.
Auto-calibration for SMT lines.
BGA, μ-BGA, ultra-ﬁne pitch QFP, QFN, and CSP, FCP & 0201
placement & repair.
Component placement to 7-mil pitch.
High layer & ultra-dense component counts.
On site ﬁrmware programming.
10-zone air convection reflow system with nitrogen atmosphere
Surface Mount Addendum
Largest BGA Size: 75mm x 75mm
BGA Pitch Range: 0.25 mm - 3 mm
Largest QFP Size: 75mm x 75mm
Smallest QFP Pitch: 0.25 mm - 3 mm
Largest PCB/Panel Size: 18" x 20"
Smallest PCB/Panel size: 1.2" Wide
Smallest Space between Adjacent Components: 0.005"
Smallest Passive Component Size: 0201
Bed of Nails (Fixture) ICT Test Station: Genrad 2280
Component Placement Speeds:
Juki - 12,500/Hr.
Component Placement Accuracy:
Juki - ±30µm (3 Sigma)
Production Line 1 *** RoHS Compliant ***
Speed line MPM / Ultra flex 3000
- Screen printer with 2D Camera System, Auto Pin Placement, Auto Wiper etc.
Juki KE760 Pick & Place
Laser Alignment & Vision System
7-mil Pitch, BGA, MicroBGA placement
Placement at 12500 CPH (Laser centring/effective tact)
One Multi-Nozzel laser head plus one high- resolution head ering/effective
From 0201 to 74mm sq. component placement capability
Juki Matric Tray Changer
Capable up to 44 different types of QFP, QFN, BGA, CSP
Heller XPM2 with Brush Roller Output
- Lead Free Compatible
- 10-zone air convection reflow including a 3 zone cooling
system with nitrogen
Juki 2060 Pick & Place
Laser Alignment & Vision System
Multi-nozzle vision centering
High Resolution & Standard Cameras
Laser Alignment vision Systems
5 Nozzles, 5 Head
Fine Pitch, BGA & MicroBGA placement at 16,000 CPH
Through Hole PRODUCTION LINE 2
IAC TH Assembly Work Station
Tech-Mation Assembly Line
Technical Device Wave Solder System (Two machine)
Lead free capability & “Quick Change” solder pot
Machine with Dancer Wave
3 convection preheaters, 1 infra-red preheater & dual
Skinner Flux Sprayer module with self contained external fluxer cabinet
Real time 3-D graphic animation of system & process
User friendly operator interface console with storage for 5000+ unique recipes
Testing & Inspection
ICT – In Circuit Testing
GenRad 2283 & GenRad 2280S
Bed of nails with ﬁxture
Open express equipped & Boundary Scan capable
Glen Brook RTX-113
19” camera system
Bandit APE Rework Station for QFP & BGA components
Tektronix 7704A Oscilloscope
Sony color 65 power inspection camera with color monitor
Mechanical Assembly / Wire Harness
Carpenter Model 70D wire stripper
Cirrus 1100 H+ Hi Pot Cable Tester
Ideal Industries Model 45-754 Measure ,cut & strip
Ideal Industries Model 45-145 Wire strip
Pico crimping Tools Model 400B crimp master
Complex RoHS & non-RoHS PCAs up to 18”x20”.
PTH, SMT & mixed technology assembly.
Single and double-sided assembly.
No clean flux process & closed loop aqueous cleaning system.
Conformal coating & potting compliant with IPC-CC-830B.
Cable & harness assembly.
Complete mechanical assembly.
Fixture & ﬁxtureless in circuit & functional testing.
Repair/rework including BGA & QFP.
Our Comprehensive Services
Electrical, PCB & layout capabilities.
DFT & DFM engineering support.
Component selection/BOM creation support.
Quick turn – 1 to 5 days.
Turnkey, consignment, or mixed model.
One piece through beta run.
Machine & hand placement.
Reflow and hand soldering.
NPI (NEW PRODUCT INTRODUCTION)
Dedicated program management.
Documentation requirements deﬁned.
Program review; kick off meeting & Project development.
Final SOW, materials, processes, & schedule documentation & sign off.
1st article inspections (Tooling, materials, & assembly) &
Release to production.
Supply Chain Management
Component sourcing - Full turnkey to full consignment based
on customer needs.
BOM analysis & suggestions for cost, availability & serviceability
Demand aggregation for cost optimization.
AVL management & supplier certiﬁcation.
Demand forecast & supplies management.
RoHS & non-RoHS Inventory management.
Our State of the Art Equipment
Prep / Kitting
Material Storage with RoHS Compliance Area
Hepco-APS 1500-1 Radial Lead Formation System
Hepco 8000-1 Axial Lead Formation System
Ideal Wire Processor
PEI OLAMEF TP6 Lead Formation System
GPD CF-8 Component Former